16Gb DDR4 Dram Memory Chips 1.2V SDRAM H5ANAG6NCJR-XNC

Dynamic Random Access Memory DRAM 16Gb DDR4 SDRAM H5ANAG6NCJR-XNC

FEATURES
• VDD=VDDQ=1.2V +/- 0.06V
• Fully differential clock inputs (CK, CK
• Differential Data Strobe (DQS, DQS
• On chip DLL align DQ, DQS and DQS
transition
• DM masks write data-in at the both rising and falling
edges of the data strobe
• All addresses and control inputs except data, data
strobes and data masks latched on the rising edges of
the clock
• Programmable CAS latency 9, 10, 11, 12, 13, 14, 15,
16, 17, 18, 19 and 20 supported
• Programmable additive latency 0, CL-1, and CL-2
supported (x4/x8 only)
• Programmable CAS Write latency (CWL) = 9, 10, 11,
12, 14, 16, 18
• Programmable burst length 4/8 with both nibble
sequential and interleave mode
• BL switch on the fly
• 16banks
• Average Refresh Cycle (Tcase of 0 oC~ 95 oC) - 7.8 µs at 0oC ~ 85 oC - 3.9 µs at 85oC ~ 95 oC
• JEDEC standard 78ball FBGA(x4/x8) Driver strength
selected by MRS
• Dynamic On Die Termination supported
• Two Termination States such as RTT_PARK and
RTT_NOM switchable by ODT pin
) operation
)
transition with CK
• Asynchronous RESET pin supported
• ZQ calibration supported
• TDQS (Termination Data Strobe) supported (x8 only)
• Write Levelization supported
• 8 bit pre-fetch
• This product in compliance with the RoHS directive.
• Internal Vref DQ level generation is available
• Write CRC is supported at all speed grades
• Maximum Power Saving Mode is supported
• TCAR(Temperature Controlled Auto Refresh) mode is
supported
• LP ASR(Low Power Auto Self Refresh) mode is sup
ported
• Fine Granularity Refresh is supported
• Per DRAM Addressability is supported
• Geardown Mode(1/2 rate, 1/4 rate) is supported
• Programable Preamble for read and write is supported
• Self Refresh Abort is supported
• CA parity (Command/Address Parity) mode is sup
ported
• Bank Grouping is applied, and CAS to CAS latency
(tCCD_L, tCCD_S) for the banks in the same or different
bank group accesses are available
• DBI(Data Bus Inversion) is supported(x8)

Packaging and transportation instructions

- According to the standard export packaging.

Customers can choose from cartons, wooden cases and wooden pallets according to their own requirements.

Q&A

1. How to obtain the price?

We usually quote within 24 hours after receiving your inquiry (except weekends and holidays). If you are in urgent need of a price, please send us an email or contact us in any other way so that we can provide you with a quotation.

2. What is your delivery time?

This depends on the quantity of the order and the season in which you place the order. Usually, we can ship the goods within 7 to 15 days (for small batches), and for large batches, it takes about 30 days.

3. What are your payment terms?

Factory price, 30% deposit, 70%T/T payment before shipment.

4. What is the mode of transportation?

It can be transported by sea, air or express delivery (EMS, UPS, DHL, TNT, FEDEX, etc.). Please confirm with us before placing an order.

5. How do you help our business establish a long-term and good relationship?

We maintain good quality and competitive prices to ensure that our customers benefit.

2. We respect every customer as our friend. We do business with them sincerely and make friends with them, no matter where they come from.

16Gb dram memory chips

DDR4 dram memory chips 1.2V

H5ANAG6NCJR-XNC

16Gb DDR4 Dram Memory Chips 1.2V SDRAM H5ANAG6NCJR-XNC Images